Method for manufacturing an electronic module, and an electronic module
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United States of America Patent
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Issued Date -
Jun 14, 2007
app pub date -
Aug 10, 2004
filing date -
Aug 26, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. A conductive adhesive, preferably an anisotropically conductive adhesive, is used in the gluing. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
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