Apparatus and clocked method for pressure-sintered bonding
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United States of America Patent
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Issued Date -
Jun 14, 2007
app pub date -
Dec 11, 2006
filing date -
Dec 9, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus and a clocked method for pressure-sintered bonding of a plurality of chiplike components to conductor tracks on a substrate. The apparatus has a pressing device, a conveyor belt, and a further device for covering the substrate with a protective film. The pressing device is suitable for clocked operation and has a pressing die with a silicone pressure cushion and a heatable pressing table. The conveyor belt is pressure-stable and extends directly above the pressing table. The protective film is disposed between the substrate, with the components disposed thereon, and the pressing die. During the clocked method, the top side of the substrate is covered with the protective film, and then the pressure-sintering operation is started by pressing the pressure cushion onto the top side of the substrate.
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