Method and apparatus for planarizing a substrate with low fluid consumption

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United States of America Patent

APP PUB NO 20070131562A1
SERIAL NO

11298643

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Yongqi San Jose, CA 61 611
Tian, Yuan A San Jose, CA 10 95
Tsai, Stan D Fremont, CA 100 1283
Tseng, Ming-Kuei San Jose, CA 18 154
Wang, Zhihong Santa Clara, CA 86 453

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