THERMAL PROCESSING SYSTEM WITH ACROSS-FLOW LINER
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United States of America Patent
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app pub date -
Jan 26, 2007
filing date -
Sep 24, 2003
priority date (Note) -
Abandoned
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Abstract
An apparatus is provided for thermally processing substrates held in a carrier. The apparatus includes an across-flow liner to improve gas flow uniformity across the surface of each substrate. The across-flow liner of the present invention includes a longitudinal bulging section to accommodate a across-flow injection system. The liner is patterned and sized so that it is conformal to the wafer carrier, and as a result, reduces the gap between the liner and the wafer carrier to reduce or eliminate vortices and stagnation in the gap areas between the wafer carrier and the liner inner wall.
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