Thermal conductive apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 21, 2007
app pub date -
Dec 13, 2006
filing date -
Dec 19, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thermal conductive apparatus includes a first electrode sheet, a second electrode sheet, a cooling sheet, and a polymer dielectric layer. The polymer dielectric layer physically contacts the first electrode sheet and the second electrode sheet via the top surface thereof, and the cooling sheet via the bottom surface thereof, and exhibits a coefficient of thermal conductivity above 1.0 W/mK. The interfaces between the first electrode sheet, the second electrode sheet, the cooling sheet, and the polymer dielectric layer include at least one micro-rough surface. The micro-rough surfaces include plural nodules thereon formed by electrodeposition. The first electrode sheet and the second electrode sheet are electrically insulated from each other and are connected to a power source and a heat-generating device to form a conductive circuit loop.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully