Method to reduce thermal stresses in a sputter target
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United States of America Patent
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Issued Date -
Jun 21, 2007
app pub date -
Mar 11, 2005
filing date -
Mar 15, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a method to reduce thermal stresses in a sputter target during sputtering. The method provides the following steps providing a target holder, applying a target material comprising indium-tin-oxide on the target holder by spraying and introducing pores in the target material while applying the target material on the target holder. These pores leading to a porosity of at least 2% in the sprayed target material to reduce thermal stresses. The invention further relates to a sputter target having reduced thermal stresses and to a process for coating a substrate surface with indium-tin-oxide.
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