Image sensor package
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United States of America Patent
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Issued Date -
Jun 21, 2007
app pub date -
Dec 16, 2005
filing date -
Dec 16, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor package includes a substrate having an upper surface, which is formed with a chip region and first electrodes located on the periphery of the chip region, and a lower surface. A chip is mounted on the chip region of the upper surface of the substrate. A frame layer is arranged on the upper surface of the substrate to surround the chip. Four posts are arranged on the upper surface of the substrate and are located on the angle the frame layer. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. A transparent layer is mounted on the four posts to cover the chip.
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