Structure and method of making capped chip having discrete article assembled into vertical interconnect
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United States of America Patent
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N/A
Issued Date -
Jun 21, 2007
app pub date -
Dec 15, 2005
filing date -
Dec 15, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A capped chip is provided which includes a chip having a front surface, a plurality of conductive features exposed at the front surface and a cap. The cap has an inner surface facing the front surface of the chip, an outer surface opposite the inner surface, and a through hole extending from the outer surface to the inner surface. A conductive interconnect extends at least partially through the through hole. The interconnect includes a conductive article which occupies a substantial portion of a volume of the interconnect and the interconnect further includes a flowable conductive medium which joins the conductive article to at least one of the plurality of conductive features of the chip or to the cap.
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