Heat transfer system
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United States of America Patent
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Issued Date -
Jun 21, 2007
app pub date -
Dec 19, 2005
filing date -
Dec 19, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Heat transfer units for use with cooling systems are presented. A number of embodiments are presented. In each embodiment a heat transfer unit is depicted wherein the flow of coolant through the unit is distributed and/or regulated to increase the efficiency of thermal transfer from heat generating components in an electronic system thermally coupled to the heat transfer unit to a coolant flowing through the heat transfer unit.
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