Packaging method for an assembly of image-sensing chip and circuit board
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United States of America Patent
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N/A
Issued Date -
Jun 28, 2007
app pub date -
Dec 28, 2005
filing date -
Dec 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A packaging method for an assembly of image-sensing chip and circuit board, including steps of: preparing a module circuit board having several leads and module circuits on a surface, an image-sensing chip being mounted on the circuit board, wires being bonded from the image-sensing chip to the leads to electrically connect the image-sensing chip with the circuit board; adhering a lens holder onto the circuit board above the image-sensing chip to enclose the image-sensing chip; mounting a lens unit having at least one lens on the lens holder and adjusting the focal length between the lens and the image-sensing chip; and airtight filling glue material to the joint between the lens unit and the lens holder to constantly fix the lens unit with the lens holder and complete the package of an image sensing module.
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