Assembly of image-sensing chip and circuit board with inward wire bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Jun 28, 2007
app pub date -
Dec 28, 2005
filing date -
Dec 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An assembly of image-sensing chip and circuit boardwith inward wire bonding, including an image-sensing chip, a circuit board and a glass board. The circuit board is formed with a window and several wire bonding slots. An image-sensing chip is adhered to the circuit board. A wire bonding area is defined between the periphery of the image-sensing area and the bond pads of the image-sensing chip. By means of the wire bonding area, wires are inward bonded, that is, toward the image-sensing area from the bond pads through the wire bonding slots to the electric contacts of the circuit board. The glass board is disposed on the circuit board to block the window corresponding to the image-sensing area. Glue material is airtight filled around the image-sensing chip and the glass board and in the wire bonding slots of the circuit board for ensuring electric connection between the bond pads and the electric contacts.
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