IC CARD WITH IMPROVED PLATED MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jul 5, 2007
app pub date -
Dec 29, 2006
filing date -
Dec 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An IC card includes a plated or protective module including a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip, a plastic support with a recess intended to host the plated module and the integrated circuit chip, with at least some of the conductive areas connected to corresponding contact points on the integrated circuit chip. A plurality of extended areas are linked to a corresponding conductive areas by one or more bridges. A couple of advanced extended areas form a rounded border of the plated module. Advanced extended areas are linked to conductive areas not connected to contact points. Advanced extended areas wrap around the extended areas and form the opposite rounded sides of the plated module.
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