Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same
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United States of America Patent
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N/A
Issued Date -
Jul 5, 2007
app pub date -
Dec 30, 2005
filing date -
Dec 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A chip-packaging composition includes a polymer of a bis-maleimide. A process includes formation of the chip-packaging composition including adding particulate fillers to achieve a coefficient of thermal expansion of about 20 ppm/K. A method includes assembly of the chip-packaging composition with a die or a mounting substrate. A computing system is also included that uses the chip-packaging composition.
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