Method and Apparatus for Low-Temperature Plasma Sintering
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United States of America Patent
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Issued Date -
Jul 5, 2007
app pub date -
Dec 14, 2006
filing date -
Dec 15, 2005
priority date (Note) -
Abandoned
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Abstract
Method and apparatus for low temperature sintering of sintering of printable conductive inks, preferably using a plasma. The inks can be deposited on a substrate using any number of deposition techniques, and can be applied to processing on materials including, but not limited to, electronic, biologic, and low-temperature substrates. The inks preferably comprise metallic nanoparticles coated with an organic non-conductive material. The plasma removes the organic material and facilitates the sintering of the metallic particles into a continuous deposit, without exposing the substrate to high temperatures.
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