Positive photosensitive composition
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United States of America Patent
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N/A
Issued Date -
Jul 5, 2007
app pub date -
May 27, 2004
filing date -
May 27, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
There is provided a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 25 to 60%, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film and is improved in scratch resistance in the handling before development. The positive photosensitive composition comprises, (A) an alkali soluble organic high molecular substance having a phenolic hydroxyl group,(B) a photo-thermal conversion material that absorbs infrared rays from an image exposure light source and converts it to heat, (C) at least one resin selected from the group consisting of; (1) vinylpyrrolidone/vinyl acetate copolymer and others, and (D) a dissolution inhibitor.
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