Process monitor for laser and plasma materials processing of materials
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United States of America Patent
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app pub date -
Jan 12, 2007
filing date -
Mar 31, 2003
priority date (Note) -
Abandoned
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Abstract
A method for monitoring the processing of a workpiece includes directing an incident laser beam onto the workpiece and measuring a signal emitted from the workpiece. At least two signals are generated by a detector based upon the emitted signal. A workpiece processing quality is determined based upon the ratio of the two output signals and a magnitude of one of the two outputs.
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