Simplified image sensor module package
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United States of America Patent
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N/A
Issued Date -
Jul 12, 2007
app pub date -
Dec 22, 2005
filing date -
Dec 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A simplified image sensor module package includes a flexible print circuit board having an upper surface, which is formed with a plurality of electrically circuits, and a lower surface. A frame layer is arranged on the upper surface of the flexible print circuit board. A chip is mounted on the upper surface of the flexible print circuit board. A plurality of wires are electrically connected the chip to the electrical circuits of the flexible print circuit board. A transparent layer is mounted on the frame layer to cover the chip. A lens holder is mounted on the frame layer, and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder.
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