Apparatus and method for the deposition of ruthenium containing films
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 12, 2007
app pub date -
Jan 7, 2006
filing date -
Jan 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a method for depositing a ruthenium metal compound containing film on one or more substrates. The desired metal compound is first dissolved in a suitable solvent. The precursor mixture is then vaporized and delivered to a process chamber to be used in the deposition of the metal compound on the substrates by process methods comprising CVD, MOCVD, ALD, and the like. This method results in the deposition of high quality, substantially uniform films. Additionally, the method makes efficient use of the metal compound component and reduces the cost for the deposition of the metal compound.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully