Resin molded article with reduced dielectric loss tangent and production method therefor
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United States of America Patent
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Issued Date -
Aug 9, 2007
app pub date -
Mar 3, 2005
filing date -
Mar 10, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A resin molded article having a reduced dielectric loss tangent is provided. This resin molded article is obtained by performing a heat treatment to a resin composition comprising a liquid-crystalline polyester and an epoxy-group containing ethylene copolymer at a temperature lower than a flow-beginning temperature of the liquid-crystalline polyester, preferably at a temperature between a lower limit temperature calculated by subtracting 120.degree. C. from the flow-beginning temperature and an upper limit temperature calculated by subtracting 20.degree. C. from the flow-beginning temperature. This resin molded article has a smaller dielectric loss tangent than the resin molded article obtained from the resin composition without the heat treatment.
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