An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
This priority date is an estimated earliest
priority date and is purely an estimation. This date should not be
taken as legal conclusion. No representations are made as to the
accuracy of the date listed. Please consult a legal professional
before relying on this date.