Heat pumped surveillance camera housing and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

11784061

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.

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Patent Owner(s)

Patent OwnerAddress
DOTWORKZ SYSTEMS INCNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baldwin, Cyrus San Diego, CA 3 33
Creighton, Mark Escondido, CA 2 29
Saielli, Zachary La Jolla, CA 2 29

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