Heat pumped surveillance camera housing and method of manufacturing the same
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Apr 5, 2007
filing date -
Oct 31, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.
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