Heat Sink Fin Structure and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Aug 30, 2007
app pub date -
Feb 24, 2006
filing date -
Feb 24, 2006
priority date (Note) -
Abandoned
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Abstract
This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat sink fins and the attachment can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a metal surface and can be mixed into the metal.
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