Heat Sink Fin Structure and Manufacturing Method Thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070199677A1
SERIAL NO

11307834

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat sink fins and the attachment can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a metal surface and can be mixed into the metal.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MITAC TECHNOLOGY CORP.HSIN-CHU HSIEN89

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chao-Yi Taipei City, TW 30 726
Cheng, Yu-Chiang Taipei City, TW 44 154
Hsiao, Wei-Chung Taipei City, TW 44 60
Hwang, Ming-Hang Taipei City, TW 11 11
Kuo, Hsin-Lung Taipei City, TW 11 11
Lee, Bin-Wei Taipei City, TW 11 11
Lee, Ping-Feng Taipei County, TW 7 13

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