Power surface mount light emitting die package

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United States of America Patent

PATENT NO 8188488
APP PUB NO 20070200127A1
SERIAL NO

11689868

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Importance

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Abstract

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A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

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Patent Owner(s)

Patent OwnerAddress
CREELED INC4400 SILICON DRIVE DURHAM NC 27703

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andrews, Peter Scott Durham, US 84 2183
Loh, Ban P Durham, US 56 2777

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