Power surface mount light emitting die package
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United States of America Patent
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-
May 29, 2012
Grant Date -
Aug 30, 2007
app pub date -
Mar 22, 2007
filing date -
May 27, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
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