Polishing composition and polishing method
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United States of America Patent
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Issued Date -
Aug 30, 2007
app pub date -
Feb 27, 2007
filing date -
Feb 28, 2006
priority date (Note) -
Abandoned
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Abstract
A polishing composition contains silica abrasive grains and an iodine compound. The silica abrasive grains exhibit a negative zeta potential in the polishing composition. The silica abrasive grains have an average primary particle size of 30 nm or smaller, and the polishing composition has a pH of 4 or lower. The polishing composition is suitable for polishing a polysilicon film and a silicon nitride film.
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