Method and apparatus for electrochemical flow field member
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United States of America Patent
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Issued Date -
Sep 6, 2007
app pub date -
Mar 3, 2006
filing date -
Mar 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A bonded flow field member for an electrochemical cell is disclosed. The member comprises a first layer and a second layer, each having a plurality of through-holes. The first layer is diffusion bonded to the second layer, thereby defining a bonded assembly. The bonded assembly includes interface surfaces that are bonded between the layers and plating that is absent at the interface surfaces.
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