Circuit Board, Method Of Manufacturing Circuit Board, And Display Device Having Circuit Board
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United States of America Patent
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Issued Date -
Sep 13, 2007
app pub date -
Mar 30, 2005
filing date -
Mar 31, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit board manufacturing method includes formation of a thermosetting photosensitive resin film on an insulating board by a spin coat method and the like, exposure of the photosensitive resin film to radiation rays such as ultraviolet rays, development with a developer or by etching, heat-hardening of the photosensitive resin film, oxygen plasma treatment or ultraviolet treatment if required, adjustment of a water quantity in the photosensitive resin film by drying the resin film, exposure in a fluorine gas atmosphere, anneal treatment, and then immersion of the resin film in a fluorinated acid chemical.
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