Semiconductor Polishing Composition
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United States of America Patent
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Issued Date -
Sep 13, 2007
app pub date -
Mar 28, 2005
filing date -
Mar 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor polishing composition is disclosed. The composition includes fumed silica, the semiconductor polishing composition being an aqueous dispersion solution of fumed silica. A content of the fumed silica includes a particle diameter of 100 nm or less is 15% by volume or more based on a total amount of the fumed silica.
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