Method and apparatus of locating the optimum peeling axis of a log and the maximum radius portion thereof with respect to the optimum peeling axis
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United States of America Patent
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Oct 2, 2007
Grant Date -
Sep 13, 2007
app pub date -
Mar 10, 2006
filing date -
Feb 28, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A method for locating an optimum peeling axis of a log and a maximum radius point on peripheral surface of the log with respect to the located optimum peeling axis and an apparatus for practicing the method are disclosed. A plurality of swingable members are provided, each member having a contact surface which is swingable in contact with the peripheral surface of the log thereby to follows the peripheral profile of the log while it is being rotated about its preliminary axis. Angular positions of the contact surfaces are measured with respect to a reference position at a number of angularly spaced positions of the log. On the basis of the measured angular positions of the contact surfaces, radial distances of the log from a plurality of predetermined locations on the optimum peeling axis to selected contact surfaces are computed for comparison such radial distances. The distance having the greatest value is regarded as the maximum radius point of the log.
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