Thin multichip flex-module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 13, 2007
app pub date -
Mar 7, 2007
filing date -
Mar 8, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thin multichip module comprises: a frame comprising a recessed cavity; a flexible circuit having a plurality of integrated circuit chips disposed thereon, the flexible circuit bonded to the frame over at least a portion of the cavity; and the chips enclosed within the cavity by the flexible circuit; and, electrodes on the module configured to be accessible to an external socket after the frame is inserted in the module.
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