Polishing composition for a tungsten-containing substrate
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United States of America Patent
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Sep 1, 2009
Grant Date -
Sep 20, 2007
app pub date -
Feb 1, 2007
filing date -
Jun 16, 2004
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Abstract
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
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