Heated single wafer megasonic processing plate
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United States of America Patent
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Issued Date -
Sep 20, 2007
app pub date -
Mar 16, 2007
filing date -
Mar 17, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for heating a megasonic wafer processing plate to approximate the temperature of the processing liquid, whereby the chemical processing of the wafer is optimized. Heater blankets may be secured to the back side of the megasonic plate, or internal heating elements or passages may be disposed within the plate.
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