Memory card structure and method for manufacturing the same
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United States of America Patent
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N/A
Issued Date -
Sep 20, 2007
app pub date -
Mar 16, 2006
filing date -
Mar 16, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A memory card structure includes a substrate, B-Stage glue, an adhered layer, a chip, wires, and a compound layer. The substrate has an upper surface, which is formed with first electrodes and golden fingers electrically connected to the first electrodes. The B-Stage glue is coated on the periphery of upper surface of the substrate. The adhered layer is coated on the upper surface of the substrate. The chip is formed with bonding pads, and is adhered on the upper surface of the substrate by the B-Stage glue and the adhered layer. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. And the compound layer is encapsulated on the chip and the wires.
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