Method for producing semiconductor components
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United States of America Patent
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app pub date -
Mar 14, 2007
filing date -
Mar 17, 2006
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Abandoned
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Abstract
A method produces semiconductor components having a substrate, a semiconductor chip and an encapsulant. Chips situated on a wafer are singulated, arranged on a substrate and electrically conductively connected to a conductor structure on the substrate. The chips on the substrate are encapsulated with an encapsulant and the semiconductor components are singulated by sawing up the encapsulant.
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