Precoat composition for organic solderability preservative
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United States of America Patent
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Issued Date -
Sep 27, 2007
app pub date -
Mar 22, 2006
filing date -
Mar 22, 2006
priority date (Note) -
Abandoned
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Abstract
An improved method of enhancing the solderability of a copper surface comprising the steps of contacting one or more copper surfaces with a pretreatment composition comprising a dilute solution of an aliphatic carboxylic acid and an additive selected from the group consisting of amines and ammonia and thereafter contacting the one or more surfaces with an organic solderability preservative composition. The improved organic solderability preservative process of the invention forms a more uniform coating that has a better appearance and color.
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