LED backlight unit without printed circuit board and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 27, 2007
app pub date -
Mar 19, 2007
filing date -
Mar 21, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 .mu.m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
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