Method for fabricating a BGA device and BGA device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 27, 2007
app pub date -
Mar 23, 2006
filing date -
Mar 23, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a method chips are provided with solder balls as of a ball grid array directly without any substrate thereby forming a BGA device. The inventive BGA device is protected on its active side by a protective layer made of solder resist or other equivalent materials and the solder balls on the contact pads of the die are suitable to be connected to an other assembly directly.
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