Multilayer solder article
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United States of America Patent
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app pub date -
Feb 22, 2006
filing date -
Aug 12, 2005
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Abandoned
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Abstract
A multilayer solder article includes a layer of a first non-lead solder for bonding to an electrically conductive material. A layer of a second non-lead solder can be on the layer of the first solder. The second solder can have a lower melting temperature than the first solder. The melting temperature of the second solder can be below about 310.degree. F.
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