Method of manufacturing a composite electronic part, and composite electronic part
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United States of America Patent
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Issued Date -
Oct 4, 2007
app pub date -
Mar 15, 2007
filing date -
Mar 30, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a composite electronic part includes: a part arrangement step of arranging a film circuit element and a chip-like electronic part on one substrate surface of a ceramic substrate; a protective layer disposition step of disposing a protective layer that protects the film circuit element and the chip-like electronic part on the one substrate surface of the ceramic substrate, and flattening an upper surface of the protective layer; and a conductive material arrangement step of, after both of the steps, arranging a plurality of conductive projections that become terminals of the film circuit element and the chip-like electronic part on the other surface of the ceramic substrate in a state where the upper surface of the protective layer abuts on a horizontal plane.
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