Rotating type soldering device
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United States of America Patent
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app pub date -
Apr 7, 2006
filing date -
Apr 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism. The rotation mechanism includes an actuator and a plurality of wheels. The heat pipe is arranged between the wheels. A soldering mechanism with a solder gun is arranged on one side of the rotation mechanism. The solder gun is corresponding to one side of the heat pipe and electrically connected to a first electrode. A pressing mechanism with a pressing plate is arranged atop the wheels. One end of the pressing plate is pressed against one side of the heat pipe and another side of the pressing plate is electrically connected to a second electrode. The electrical arc is intense and the thermal deform of heat pipe is small.
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