Rotating type soldering device
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United States of America Patent
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app pub date -
Apr 7, 2006
filing date -
Apr 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism and a soldering mechanism. The rotation mechanism includes an actuator and a pair of wheels driven by the actuator. The wheels are conductive and electrically connected to a first electrode. The heat pipe is arranged between the wheels and in rotational contact with the wheels. The soldering mechanism is arranged on one side of the rotation mechanism and includes a solder gun corresponding to a first end of the heat pipe. The solder gun is electrically connected to a second electrode and used to seal an opening end of the heat pipe. The electrical arc is intense and the thermal deform of heat pipe is small.
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