INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
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United States of America Patent
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Issued Date -
Oct 11, 2007
app pub date -
Mar 30, 2006
filing date -
Mar 30, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit package system is provided providing an integrated circuit die having a final metal layer of the semiconductor process used to manufacture the integrated circuit die and a passivation layer provided thereon, depositing a first metal layer on the passivation layer and the final metal layer, forming an analog circuit in the first metal layer, coating a first insulation layer on the first metal layer and the passivation layer, exposing a first pad and a second pad of the first metal layer through the first insulation layer, and connecting a first interconnect on the first pad and a second interconnect on the second pad.
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