Process for creating a pattern on a copper surface
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United States of America Patent
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Issued Date -
Oct 11, 2007
app pub date -
Apr 5, 2006
filing date -
Apr 5, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
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