Image sensor package structure and method for manufacturing the same
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United States of America Patent
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Issued Date -
Oct 18, 2007
app pub date -
Apr 14, 2006
filing date -
Apr 14, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.
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