Apparatus Comprising a Thermal Bimorph with Enhanced Sensitivity
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United States of America Patent
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Issued Date -
Oct 18, 2007
app pub date -
Apr 17, 2006
filing date -
Apr 17, 2006
priority date (Note) -
Abandoned
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Abstract
A thermal bimorph that exhibits improved layer adhesion and an enhanced bending response is disclosed. The thermal bimorph incorporates corrugations that extend fully through the bimorph to its two major surfaces. In some embodiments, the thermal bimorph is asymmetrically corrugated.
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