SURFACE-MOUNTING CERAMIC ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Oct 18, 2007
app pub date -
Apr 3, 2007
filing date -
Apr 4, 2006
priority date (Note) -
Abandoned
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Abstract
One inventive aspect relates to a surface-mounting ceramic electronic component including a terminal electrode structure which improves the mechanical strength of the electronic component. In the terminal electrode structure, an intermediate metal layer is formed on a base metal layer, and a conductive resin layer is formed thereon. A surface of the base metal layer in which a common material, an oxide film, glass frit or the like exists is covered with the intermediate metal layer, and the conductive resin layer is adhered to the intermediate metal layer as a tight metal surface.
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