Method for manufacturing memory card structure
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United States of America Patent
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N/A
Issued Date -
Oct 25, 2007
app pub date -
Apr 20, 2006
filing date -
Apr 20, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for manufacturing memory card structure comprises the steps of. Providing a carry has an upper surface, which is coated with adhered glue, and a lower surface. Providing a substrate has a first surface, which is formed with first electrodes, and a lower surface, a golden finger is formed on the substrate, and is electrically connected to the first electrodes. Providing a passive component is mounted on the first surface of the substrate. Separating the substrate and the carry. Providing a chip is mounted on the first surface of the substrate. Providing a plurality of wires is electrically connected the chip to the first electrodes of the substrate. Providing a compound resin is covered on the chip and wires.
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