Structure for cooling a power adapter

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7492597
APP PUB NO 20070247817A1
SERIAL NO

11493726

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A power adapter includes a housing formed of a bottom cover shell and a top cover shell and having an air passage extending across the bottom cover shell and an exhaust port in the top cover shell, a PC board mounted in the housing, two heat sinks covered on the PC board for absorbing heat from the primary and secondary sides of the PC board respectively for enabling absorbed heat to be carried to the outside of the housing by outside cooling air that is circulating through the exhaust port and the air passage, and a spacer set in the air passage between the heat sinks and working with the heat sinks to protect the PC board against outside dust and water.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CHICONY POWER TECHNOLOGY CO., LTD.TAIPEI HSIEN85

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Ming-Ho Taipei Hsien, TW 20 57

Cited Art Landscape

Patent Info (Count) # Cites Year
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
* 5258888 Thermal packaging for natural convection cooled electronics 60 1992
 
SWITCHED RELUCTANCE DRIVES LIMITED (1)
* 5723858 Position encoder with fault indicator 15 1997
 
ACBEL POLYTECH INC. (1)
* 2005/0248,923 POWER ADAPTER WITH HEAT SINK DEVICE 6 2004
 
RALLY MANUFACTURING, INC. (1)
* 6411514 Power inverter with heat dissipating assembly 47 2001
 
DELTA ELECTRONICS, INC. (3)
* 6081425 Miniaturizing power supply system for portable computers by improving heat dissipation therein 51 1999
* 6776650 Waterproof and heat-dissipating structure of electronic apparatus 21 2003
* 6820686 Heat-dissipating casing of electronic apparatus 6 2003
 
GRE ALPHA ELECTRONICS LTD. (1)
* 7154755 Power supply assembly 11 2004
 
ASIAN POWER DEVICES INC. (1)
* 2007/0053,157 Power supply device with an electromagnetic compatiblity heatsink 2 2005
 
MITSUMI ELECTRIC CO., LTD. (1)
* 7300302 AC adapter with heat radiation sheet 9 2006
 
Long Well Electronics Corp. (1)
* 6046908 Heat-radiating structure of power adapter 61 1998
 
Jerome Industries Corp. (1)
* 5831847 Power supply with separated airflows 44 1997
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
FSP TECHNOLOGY INC. (1)
* 8169781 Power supply and heat dissipation module thereof 2 2010
 
HON HAI PRECISION INDUSTRY CO., LTD. (1)
* 2014/0332,181 AIR DUCT 0 2013
 
Lite-On Electronic (Guangzhou) Limited (1)
* 2012/0147,565 HEAT DISSIPATION AND TEMPERATURE-HOMOGENIZING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME 4 2011
 
APPLE INC. (1)
* 2013/0050,945 Electronic Device Enclosures with Engagement Features 3 2011
 
CONTINENTAL AUTOMOTIVE GMBH (1)
* 9398710 Enclosure for an electronic control unit and electronic control unit 0 2014
 
SKYERA, LLC (2)
* 9301402 High density server storage unit 0 2014
* 2014/0268,536 HIGH DENSITY SERVER STORAGE UNIT 1 2014
 
QLOGIC CORPORATION (1)
* 8068338 Network device with baffle for redirecting cooling air and associated methods 2 2009
 
TOYOTA JIDOSHA KABUSHIKI KAISHA (2)
* 8369067 Electricity feeding control device 1 2010
* 2011/0122,548 ELECTRICITY FEEDING CONTROL DEVICE 0 2010
 
INFINEON TECHNOLOGIES AUSTRIA AG (1)
9642289 Power supply and method 0 2013
* Cited By Examiner

Maintenance Fees

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 17, 2020
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