Conductive stiffener for a flexible substrate
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United States of America Patent
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Jan 19, 2010
Grant Date -
Nov 1, 2007
app pub date -
May 1, 2006
filing date -
May 1, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
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