DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 8, 2007
app pub date -
May 3, 2007
filing date -
May 5, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be soldered to the leadframe pads before or after assembly to the plate. The insulation layer may be a curable epoxy or a B stage IMS plate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully