SIMULTANEOUS INORGANIC, ORGANIC AND BYPRODUCT ANALYSIS IN ELECTROCHEMICAL DEPOSITION SOLUTIONS
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United States of America Patent
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Issued Date -
Nov 15, 2007
app pub date -
Feb 2, 2007
filing date -
Feb 2, 2006
priority date (Note) -
Abandoned
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Abstract
Real-time analysis of electrochemical deposition (ECD) metal plating solutions is described, for the purpose of reducing plating defects and achieving high quality metal deposition. Improved plating protocols are utilized for increasing potential signal strength and reducing the time required for each measurement cycle. New methods and algorithms for simultaneously determining concentrations of organic additives, inorganic additives, and/or byproducts in a sample ECD solution are described. In one aspect, a method is provided for simultaneously determining concentrations of all organic additives, inorganic additives, and/or byproducts within a single experimental run by using a single analytical cell, while interactions between such additives are properly accounted for.
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